DefensePro™

Apacer has developed a tailor-made technology set, “DefensePro™,” to cope with the severe environments of defense applications and help customers find the right solutions.

Apacer has developed a tailor-made technology set, “DefensePro™,” to cope with the severe environments of defense applications and help customers find the right solutions, further simplifying the process of implementation. DefensePro™ is classified into three levels based on customersʼ requirements and Apacerʼs strong industry background.

  • Three-level technology solution developed for the defense sector 
  • Improves product reliability and data security with key technologies
  • Helps customers accelerate technology adoption and deployment for specific applications
 
Related Technologies
Anti-Sulfuration

Apacer's world's first patented anti-sulfuration DRAM modules and anti-sulfuration SSDs with the industry's highest level of anti-corrosion certification can meet the needs of industrial pro...

Conformal Coating

Conformal coating improves product reliability when applied on the surface of printed circuit boards. This protective film can safeguard devices from dust ingression and liquid immersion.

CorePower

Apacer's CorePower is a hardware-based technology designed to prevent data loss and ensure the stability of data transmission during a power outage by implementing backup power supply that a...

DataDefender™

Apacer’s DataDefender™ combines both firmware and hardware mechanisms to ensure data integrity. Together, they allow more time for volatile data to be stored in the event of power loss.

End-to-end Data Protection

This technology ensures that whenever data moves from the host to the controller or from the controller to DRAM or NAND flash, error checking is applied. In some cases, error correction will...

Nano Coating

This IP57 waterproof and dustproof solution is especially ideal for SSD modules as it provides invulnerable protection for the components on the devices.

Sidefill

Apacer’s Sidefill technology strengthens the connections between solder joints and their board, making them more robust and vibration-resistant. It also allows for heat dissipation to offset...

TCG Opal 2.0

TCG Opal handles the encryption/decryption of information within the device without requiring a host, enabling fast encryption/ decryption and minimizing the risk of data leakage without und...

Underfill

Underfill technique is used under the BGA to strengthen solder joints, and reinforce the product’s resistance against vibration and thermal shock

Wide Temperature

Apacer’s products are designed with wide temperature support to ensure operation reliability in extreme temperatures ranging from -40ºC to 85ºC.

30µ Gold Finger

With the 30µ gold plating, the connector interface is more reliable and can withstand the potential damages in industrial applications.