DefensePro

Apacer has developed a tailor-made technology set, “DefensePro™,” to cope with the severe environments of defense applications and help customers find the right solutions.

Apacer has developed a tailor-made technology set, “DefensePro™,” to cope with the severe environments of defense applications and help customers find the right solutions, further simplifying the process of implementation. DefensePro™ is classified into three levels based on customersʼ requirements and Apacerʼs strong industry background.

  • Three-level technology solution developed for the defense sector 
  • Improves product reliability and data security with key technologies
  • Helps customers accelerate technology adoption and deployment for specific applications
 
Related Technologies
Anti-Sulfuration

With the issue of sulfuration in industrial environment in mind, Apacer has developed the world’s first range of anti-sulfuration memory modules, allowing them to operate steadily in a harsh sulfur-containing environment to meet high industrial standards.

Conformal Coating

Conformal coating ensures reliability of products by applying coatings on the surface of printed circuit boards. The protective film can safeguard devices from dust ingression and liquid immersion.

CorePower

Apacer's CorePower is a hardware-based technology designed to prevent data loss and ensure the stability of data transmission during a power outage by implementing backup power supply that allows sufficient time to move all cached data to NAND flash.

DataDefender

Apacer’s DataDefender™ combines both firmware and hardware mechanisms to ensure data integrity. Together, they allow more time for volatile data to be stored in the event of power loss.

End-to-end Data Protection

This technology ensures that whenever data moves from the host to the controller or from the controller to DRAM or NAND flash, error checking is applied. In some cases, error correction will also be part of the circuit.

Nano Coating

This IP57 waterproof and dustproof solution is especially ideal for SSD modules as it provides invulnerable protection for the components on the devices.

TCG Opal 2.0

TCG Opal handles the encryption/decryption of information within the device without requiring a host, enabling fast encryption/ decryption and minimizing the risk of data leakage without undermining system performance.

Underfill

Underfill technique is used under the BGA to strengthen solder joints, and reinforce the product’s resistance against vibration and thermal shock

Wide Temperature

Apacer’s products are designed with wide temperature support to ensure operation reliability in extreme temperature ranging from -40ºC to 85ºC.

30µ Gold Contact

With the 30µ gold plating, the connector interface is more reliable and can withstand the potential damages in industrial applications.