Apacer Industrial - The most reliable storage and memory for industries

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Anti-Sulfuration

Apacer's world's first patented anti-sulfuration memory modules and anti-sulfuration SSDs with the industry's highest level of anti-corrosion certification can meet the needs of industrial products facing harsh environments.

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Conformal Coating

Conformal coating improves product reliability when applied on the surface of printed circuit boards. This protective film can safeguard devices from dust ingression and liquid immersion.

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CoreGlacier™

If the working environment is already hot, and an SSD’s operation causes it to increase in temperature as well, the result could be damage to the hardware or corrupted data. CoreGlacier™ helps keep an SSD cool and functioning correctly.

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ESD Protection

Excellent electrostatic protection which has passed the IEC 61000-4-2: air discharge ±15KV and contact discharge ±8KV. Provides protection for electromagnetic susceptibility (EMS) that meets the medical equipment standard EN60601-1-2.

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Nano Coating

This IP57 waterproof and dustproof solution is especially ideal for SSD modules as it provides invulnerable protection for the components on the devices.

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Sidefill

Apacer’s Sidefill technology strengthens the connections between solder joints and their board, making them more robust and vibration-resistant. It also allows for heat dissipation to offset thermal damage.

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Thermal Sensor

Thermal sensor monitors the temperature of SSD devices via S.M.A.R.T. commands. With Thermal Throttling Technology, the host system can take preventive actions by monitoring temperature changes of SSD.

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Thermal Cycling

This protection technology prevents damage to components when wild temperature swings take place. Apacer’s in-house testing facility can check to ensure thermal cycling resistance and modify a standard product if needed.

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Thermal Throttling

Thermal throttling mechanism dynamically adjusts frequency scaling to enhance data reliability and provides sustained performance while overheating.

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Underfill

Underfill technique is used under the BGA to strengthen solder joints, and reinforce the product’s resistance against vibration and thermal shock

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Wide Temperature

Apacer’s products are designed with wide temperature support to ensure operation reliability in extreme temperatures ranging from -40ºC to 85ºC.

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30µ Gold Finger

With the 30µ gold plating, the connector interface is more reliable and can withstand the potential damages in industrial applications.

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