As applications of memory in high vibration and shock environments are becoming more diverse, Apacer, the global leader in industrial memory, launches the latest rugged memory module XR-DIMM, showcasing incomparable reliability and flexibility space usage in memory industry. Following its success in penetrating the automotive system market, Apacer is expanding its business into high-end niche market of industrial applications, such as transportation, defense and aerospace, and intelligent logistics, where superior anti-shock and anti-vibration abilities are required.
Innovative Rugged Memory Design
Apacer’s rugged memory XR-DIMM uses the innovative board-to-board connector design to fit tightly and securely onto the motherboard. In addition, it adopts the highly durable 300-pin connector and mounting holes to effectively prevent memory modules from dislocating or coming away due to vibration or strong impact. This greatly improves the reliability of memory signal transmissions, serving as the strongest support for applications working under severe environments.
Since the launch of 2018’s CES, self-driving technology, smart cars and the IoV (Internet of Vehicles) have been hot topics. Automotive electronics has been repeatedly expected to be the driving force behind the growth of the global semiconductor industry, while the defense and aerospace field is usually thought as a market opening to early adoptions of innovative technologies. Cindy Huang, Director of the Vertical Market Application Business Division, points out that the market demands for rugged memory are on the rise; its applications in unmanned vehicles range from self-driving cars and smart IoV to defense and aerospace and intelligent logistics. In the past, to deal with vibration and shock environments, onboard memories were utilized for better reliability. However, the traditional onboard memories have the disadvantages of upgradability, limited capacity and performance, in addition to being tricky and costly to repair and unable to stack, taking up more space on the motherboard. Apacer XR-DIMM’s innovative connection design successfully solves the long-standing problems faced by traditional memory modules operating under special application environments. This also creates a new direction for the design of industrial computers’ motherboard.
Multiple Protection Technologies and Value-Added Applications
The XR-DIMM’s sealed board-to-board connector is designed to cope with the severe environments of automotive electronics and defense and aerospace fields, avoiding the traditional memory’s gold finger’s problem of possible oxidation when exposed to outdoor contaminating environments. Also, the XR-DIMM’s Underfill technology further strengthens its anti-vibration ability and thermal shock resistance. Meanwhile, the Apacer XR-DIMM also supports the guaranteed industrial grade Wide-Temp chips and has a built-in thermal sensor to monitor the memory’s temperature, effectively preventing the memory module from overheating. Additionally, the Conformal Coating and Anti-Sulfuration technology ensure that the products can operate stably not only under humid and dusty environments but also environments where sulfur-containing gases pervade, providing a whole new option in industrial-grade memory.
Apacer XR-DIMM’s connector design meets the anti-vibration and anti-shock standards of MIL-STD-810 and ANSI/VITA 47-2005. XR-DIMM is compatible with DDR4 2133/2400 specification, supports ECC function and comes in two capacity choices of 8 GB and 16 GB. Having innovative anti-vibration design and multiple protection technologies, Apacer’s XR-DIMM is the world’s only memory product that is not only anti-vibration, high and low temperature resistant, but also anti-humidity, anti-dust and anti-sulfuration. It is an invincible product within the memory industry and opens up endless possibilities for the future development of smart applications.