VLP ECC SODIMM
DDR4 VLP ECC SODIMM
- Support ECC error detection and correction
- On-DIMM thermal sensor : Yes
- Package: 260-pin socket type small outline dual in-line memory module (ECC SODIMM)
- PCB: height 17.78 mm, lead pitch 0.50 mm (pin),
- Power Supply: VDD=1.2V (1.14V to 1.26V)
- 16 internal banks (4 Bank Groups)
- Average refresh period
7.8us at 0°C≦ TC ≦85°C
3.9us at 85°C ≦TC ≦95°C - Lead-free (RoHS compliant)
- Halogen free
- PCB: 30μ gold finger
- Conformal Coating / Underfill (optional)
- Anti-sulfuration (Apacer patented) (optional)
Introduction
VLP ECC SODIMM (Very Low Profile ECC SODIMM) is a JEDEC-compliant design that measures only 0.7 inch in height, making it ideal for space-constraint systems, such as small-size industrial computers and embedded systems. Using VLP ECC SODIMM not only prevents mechanical issues but the space saved may be used to improve heat dissipation, save energy, cut down business cost and improve system stability. Furthermore, it supports ECC function to detect and correct data errors, and a built-in temperature-monitoring thermal sensor to prevent overheating and improve the memory module’s reliability.
Spec
OPEN- Module Type VLP ECC SODIMM
- Memory Technology DDR4
- Frequency 2133/2400/2666/2933/3200
- Density 4G/8G
- Voltage 1.2V
- Pin Count 260-Pin
- Width 72-Bit
- PCB Height 0.7"
- Operation Temperature TC=0℃ to 85℃
- Technology Thermal Sensor / 30µ Gold Finger
- Application Internet of Things / Transportation