VLP Mini ECC UDIMM is a JEDEC-compliant design characterized by its small size, and its high performance and high stability. Measuring only 82mm long and 18.8mm high, its compact size is especially applicable for space-constraint networking, communication, server and embedded systems. It also supports ECC function to detect and correct data errors, and a built-in temperature-monitoring thermal sensor to prevent overheating and improve the memory module’s reliability.
- Module Type VLP Mini ECC UDIMM
- Memory Technology DDR3
- Frequency 1066/1333/1600
- Density 1G/2G/4G
- Voltage 1.5v/1.35v
- Pin Count 244-Pin
- Width 72-Bit
- PCB Height 0.738"
- Operation Temperature TC=0℃ to 85℃
- Technology Thermal Sensor / Conformal Coating / 30µ Gold Contact
- Application Cloud Computing / Embedded & IPC