• Support ECC error detection and correction
  • On-DIMM thermal sensor : Yes
  • Package: 240-pin socket type dual in-line memory module (ECC UDIMM)
  • PCB: height 18.75 mm, lead pitch 1.0 mm (pin)
  • Power supply VDD: 1.35V (+0.1V ~ -0.067V) / 1.5V(± 0.075V)
  • Eight Internal banks for concurrent operation (components)
  • Supports auto pre-charge option for each burst access
  • Supports auto-refresh/self-refresh
  • Refresh cycles: 7.8 ㎲ at 0℃≦ TC ≦ +85℃
  • PCB: 30μ gold finger
  • Conformal coating/Underfill(optional)


VLP ECC UDIMM (Very Low Profile ECC Unbuffered DIMM) is a JEDEC-compliant design that measures only 0.738-inch in height, making it ideal for space-constraint systems, and servers and workstations that require high stability. Using VLP ECC UDIMM not only prevents mechanical issues but the space saved may be used to improve heat dissipation, save energy, cut down business cost and improve system stability. Furthermore, it supports ECC function to detect and correct data errors, and a built-in temperature-monitoring thermal sensor to prevent overheating and improve the memory module’s reliability.


  • Module Type VLP ECC UDIMM
  • Memory Technology DDR3
  • Frequency 1066/1333/1600
  • Density 1G/2G/4G/8G
  • Voltage 1.5v/1.35v
  • Pin Count 240-Pin
  • Width 72-Bit
  • PCB Height 0.738"
  • Operation Temperature TC=0℃ to 85℃
  • Technology Thermal Sensor / Conformal Coating / 30µ Gold Contact
  • Application Cloud Computing / Embedded & IPC / Healthcare